(1) Skin Bond Cement was applied to the skin grafted area of the abdomen and the backs of the wafer pieces.

(2) Bammy is a toasted bread-like wafer made from cassava.

(3) Angle the blade against the stone then push the blade lightly along as if you were trying to slice off a paper-thin wafer of stone.

(4) Family gather to share the oplatek, a thin white wafer sometimes called angel bread, followed by an odd number of meatless dishes.

(5) Mary was at the front, and she opened her mouth for the Priest to place the small wafer of bread on her tongue, the body.

(6) Most chip manufacturers use laser fuses that are activated during the testing portion of the manufacturing process before the individual chips are cut from that wafer .

(7) The company's costs have risen dramatically thanks to its investment in 300 mm wafer fabs.

(8) Faith, holding her chalice and Eucharistic wafer , stands to the right of Charity, while Hope, with her back turned to the viewer, looks to Charity from her left.

(9) In Spain, the dance is done to reverence the Blessed Sacrament, a consecrated wafer used in Communion.

(10) Lithography tools are used to draw the lines of a circuit on to a semiconductor wafer .

(11) The pink wafer biscuit is a lightweight in the World of the Biscuit.

(12) Remove the ice cream from the mould and serve with wafer biscuits or ice cream topping.

(13) Increasingly semiconductor firms are cutting back on their own wafer fabrication plants and using outsourcing firms.

(14) The combination of real milk chocolate, crisp wafer and soft chewy caramel is almost too intense.

(15) Many of these microscopic devices must be interconnected by metal wires, which are made by filling tiny trenches in the surface of the semiconductor wafer .

(16) This wafer functions as an artificial retina; light hitting the wafer causes it to generate electrical stimuli that are applied to the optic nerve and restore some degree of vision.

(17) A wafer of ice

(18) Disclosed is a method for making reliable interconnect structures on a semiconductor wafer having a first dielectric layer.

(19) Additionally, the semiconductor wafer is subjected to a flow of ions from an ionization source within the tracking device itself.

(20) A carrier is then bonded to an upper surface of the integrated circuit, whereafter a lower portion of the wafer substrate is removed in a grinding and etching operation.